AI compute hardware is entering a higher-power operating regime. In 2026, GPUs based on the NVIDIA Vera Rubin architecture are reaching power levels of up to 3,700 W, more than five times that of the H100. As power density continues to increase, liquid cooling is moving from an optional approach tow

IDC projects that global data volume will exceed 527 ZB by 2029. The growing adoption of generative AI and edge inference devices is driving higher volumes of data generation and storage, reshaping the global supply-demand balance for memory.The current storage shortage is not simply another phase o

High-bandwidth memory (HBM) has become a critical memory technology for the next generation of artificial intelligence (AI) computing and high-performance computing (HPC) systems. As AI workloads continue to expand, the demand for higher memory bandwidth, improved power efficiency, and long-term sys

IntroductionAs AI computing platforms continue to increase in power density, ensuring reliable power delivery has become a fundamental engineering challenge. High-performance AI servers operate under significantly higher electrical and thermal stress than conventional computing platforms, placing in

The pervasive penetration of artificial intelligence technology is driving the global semiconductor industry into an in-depth iteration cycle. As the core foundation of the intelligent industry, chips’ performance iteration, quality control and mass production verification capabilities have become

1. IntroductionIn advanced AI compute systems, power delivery is increasingly a primary design constraint alongside compute density and memory bandwidth. As GPU architectures scale toward higher parallelism and increased workload intensity, device-level current demand is reaching kiloampere-class op

In today's era of surging AI computing power, a brutal physical reality confronts all tech giants: the limit of computing power is energy.As the parameter count of large language models grows exponentially, the power consumption of AI servers is breaking through the limits of infrastructure capa

Time flies, and new glories unfold. On January 23, 2026, ACROVIEW Group's annual meeting themed AI Dreams, "Chip" Future grandly kicked off on the 5th floor of Crowne Plaza Shenzhen Nanshan by Metro. More than a grand gathering to review the group's annual achievements and unite it

As the wave of semiconductors sweeps through global manufacturing, each technological iteration reshapes the industrial landscape. On December 18, 2025, the highly anticipated 21st South China SMT Academic and Applied Technology Annual Conference will commence at the Shenzhen Baoan Denhill Internati

Shenzhen, China –June 17, 2025– In a landmark move for semiconductor testing, Teradyne (NASDAQ: TER) and Acroview Technology Co., Ltd. (ACROVIEW) today formalized a strategic partnership through a signing ceremony at Acroview's Shenzhen headquarters. The event brought together industry leaders including Teradyne's Asia-Pacific VP Richard Hsieh and Acroview CEO Huang Binhua, alongside key clients and semiconductor association representatives.