Chip Sorting_Semiconductor Testing_Chip Burn-in Testing_Acroview Technology Co., Ltd.

AI compute hardware is entering a higher-power operating regime. In 2026, GPUs based on the NVIDIA Vera Rubin architecture are reaching power levels of up to 3,700 W, more than five times that of the H100. As power density continues to increase, liquid cooling is moving from an optional approach tow

IDC projects that global data volume will exceed 527 ZB by 2029. The growing adoption of generative AI and edge inference devices is driving higher volumes of data generation and storage, reshaping the global supply-demand balance for memory.The current storage shortage is not simply another phase o

High-bandwidth memory (HBM) has become a critical memory technology for the next generation of artificial intelligence (AI) computing and high-performance computing (HPC) systems. As AI workloads continue to expand, the demand for higher memory bandwidth, improved power efficiency, and long-term sys